Liquid Cooling for High‐Heat‐Flux Electronic Devices

This chapter presents high-performance spray cooling system for co-designing nozzle configuration and electronics for thermal management and it is demonstrated on high-power LEDs. It introduces jet impingement body cooling device and a channel/jet impingement hybrid body cooling device with micronozzles using the traditional mechanical machining method. The body cooling devices provide high efficient cooling to the top surface and the side surfaces of the chip. The chapter introduces a compact jet array impingement cooling system driven by integrated piezoelectric micropump. The jet array impingement cooling system provides a high thermal performance and reduces the size of the thermal management system by integrating jet impingement cooling with piezoelectric micropump. The chapter introduces a bilayer compact thermal model by considering 3D heat spreading and thermal conduction for the junction temperature gradient prediction in microchannels with nonuniform heat source.