3D Printable, form stable, flexible phase-change-based electronic packaging materials for thermal management

Phase change materials (PCMs) have been proven to be promising electronic packaging materials to passively control electronics heating and cooling, but the poor thermal stability and processability greatly hinder their applications. Herein, flexible composite PCMs with perfect shape-stabilized, high latent heat energy storage density and good 3D printability were prepared using a scalable swelling strategy by limiting paraffin to a three-dimensional flexible polymer network. We successfully and accurately packaged the phase-change-based electronic packaging materials into the microelectronic devices according to complex circuits structure using fused jet deposition 3D printing technology. Compared with conventional electronic packaging materials, after packing our novel phase-change-based electronic packaging materials, the cooling effect of 13 ℃ can be achieved. This 3D printable shape-stabilized phase-change-based electronic packaging materials show promising thermal management ability and can effectively address the heat dissipation problem of integrated electronics.