Tailoring the electrical and magneto-electric transport properties of ZnO films via Ti ion implantation

A significant development toward semiconductor-based electronic devices is based on the electric and magneto-electric control of the transport properties of the charge carriers. This study unprecedentedly investigates the Ti implantation and thereafter the effect of structural defects on the electrical and magneto-electric transport properties of Ti-implanted RF-sputtered ZnO thin films. Theoretical stopping and range of ions in matter simulations along with the experimental structural and elemental studies reveal that Ti ion implantation generates a significant amount of oxygen vacancy (VO) defects apart from Ti-related impurities in post-implantation annealed films. The film implanted with 8 × 1015 ions/cm2 (TZO815) exhibits the lowest resistivity (4.68 × 10−3 Ω cm) and the highest carrier concentration (6.61 × 1020 cm−3) values. Resistivity measurements over a temperature range of 5-300K indicate semiconducting behavior for all the films implanted up to fluences of 5 × 1015 ions/cm2 identified with a grain boundary dominated thermally activated band, nearest neighbor hopping, and Mott and Efros–Shklovskii (ES) variable range hopping conduction mechanisms at various temperature intervals. Notably, the gradual decrease in both Mott and ES hopping ranges following Ti implantation indicates the formation of more localized states. Interestingly, the TZO815 film exhibits metal-semiconductor transition around 220 K, suggesting the formation of a degenerate band within the ZnO conduction band upon Ti implantation. Remarkably, the magnetoresistance results align with a semiempirical formula proposed by Khosla and Fischer, indicating that a negative magneto resistance in the TZO thin films is attributed to the spin-dependent scattering of conduction electrons by the localized magnetic moments induced mainly by the implantation induced VO defects.