跨导
带宽扩展
电子工程
计算机科学
CMOS芯片
电容器
运算跨导放大器
带宽(计算)
拓扑(电路)
放大器
运算放大器
电气工程
电压
工程类
电信
晶体管
音频信号
数字信号处理
作者
Behnam Abdollahi,Baset Mesgari,Saeed Saeedi,Ehsan Roshanshomal,Abdolreza Nabavi,Horst Zimmermann
出处
期刊:IEEE Transactions on Circuits and Systems Ii-express Briefs
[Institute of Electrical and Electronics Engineers]
日期:2021-10-20
卷期号:69 (3): 834-838
被引量:4
标识
DOI:10.1109/tcsii.2021.3121336
摘要
This brief presents a TIA topology with an active feedback path and a current bleeding circuit to relax the tradeoffs among gain, bandwidth and headroom limitations in a low voltage design. Using a two-stage common-source amplifier in the feedback path creates adequate degrees-of-freedom in the design for lowering the input resistance of the TIA and improving the bandwidth without degrading the amplifier gain. Analysis of the TIA transfer function and noise provide design guidelines for a well-behaved time response and low input-referred current noise. To demonstrate efficiency of the proposed technique, two designs in $0.18~\mu \text{m}$ CMOS technology with different values of the input capacitor are presented. The comparison of the designs with two categories of TIAs reported in the literature validates effectiveness of the presented transconductance boosting technique and demonstrates the flexibility of the proposed topology for different applications with a vast variety of the capacitance values at the TIA input.
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