作者
Yusheng Bian,Koushik Ramachandran,Zhuo-Jie Wu,Brittany Hedrick,Kevin Dezfulian,Thomas Houghton,Karen Nummy,Daniel Fisher,Takako Hirokawa,Keith Donegan,Francis O. Afzal,Monica R. Esopi,Vaishnavi Karra,Won Suk Lee,Massimo Sorbara,Jorge Lubguban,Jae Kyu Cho,Rongtao Cao,Hanyi Ding,Sujith Chandran,Michal Rakowski,Abdelsalam Aboketaf,S. Krishnamurthy,Scott Mills,Bo Peng,Jeff Pepper,Suruj S. Deka,Wang Feng,Steven Rishton,Marcel Boudreau,Dylan F. Logan,Ryan Hickey,Prova Christina Gomes,K. Murray,Arnab Dewanjee,Dave Riggs,N. Robson,Ian Melville,Rod Augur,Robert Fox,Vikas Gupta,Anthony W. Yu,Ken Giewont,John Pellerin,Ted Letavic
摘要
Enabling cost-effective and power-efficient laser source on a silicon photonics (SiPh) platform is a major goal that has been highly sought after. In the past two decades, tremendous effort has been made to develop various on-chip integration techniques to enhance SiPh circuits with efficient light-emitting materials. Here we review our recent advancements in hybrid flip-chip integration of III-V lasers on a 300-mm monolithic SiPh platform. By leveraging advanced complementary metal oxide semiconductor (CMOS) manufacturing processes, we have demonstrated wafer-scale laser attach based on a precisely controlled cavity formed on a silicon-on-insulator (SOI) substrate. The laser integration process is aided by precise mechanical alignment features on the SiPh wafer and high-precision fiducials on the laser. Efficient laser-to-SiPh-circuit butt-coupling with optical power up to 20 mW was demonstrated through wafer- and module-level characterizations. Key performance metrics including side-mode suppression ratio, mode-hopping, and relative intensity noise were characterized after laser integration. In addition, early reliability assessments were performed on laser-attached SOI wafers and Si submount assemblies to understand the long-term performance stability of the lasers on the monolithic platform. To further enhance the performance of the laser-integrated chip, we explored alternative spot-size converters that could simultaneously enable improved coupling efficiency and relaxed fabrication tolerance, thus showing great promise over traditional designs.