热冲击
休克(循环)
材料科学
热的
结构工程
图层(电子)
机械工程
机械
工程类
复合材料
热力学
物理
医学
内科学
作者
Denis Orlov,Valeria Serdakova,Maxim Evtushenko,Ekaterina Khnyryova,Alexandra Nikolaeva
出处
期刊:Lecture notes in networks and systems
日期:2023-01-01
卷期号:: 3085-3093
被引量:1
标识
DOI:10.1007/978-3-031-21432-5_340
摘要
The paper considers the features of the numerical simulation of a thin plate under the thermal shock in the ANSYS package. The temperature fields of one-layer and three-layer plates are investigated. Their comparative analysis is carried out. The features of the results obtained are identified and explained using various models. The presented results can be used to simulate the thermal shock of a thin plate using the ANSYS package.
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