Self‐Assembled Multifunctional 3D Microdevices

Multifunctional 3D microstructures have been extensively investigated for the development of new classes of electronic and optical devices. Here, functionalized, free‐standing, hollow, 3D, dielectric (150 nm thick aluminum oxide) microcontainers with metal patterning on their surfaces are realized by an evolved self‐assembly approach. To functionalize the 3D structure and use it as a device, metal patterns, arrays of split‐ring resonators (SRRs) acting as metamaterials, are defined on the surface of the 3D dielectric microcontainers. The SRRs on all six facets of a given microcube show a resonant behavior in terahertz regimes. Since desired metal and semiconductor patterns can be incorporated onto surfaces of 3D dielectric microstructures, this self‐assembly process can be harnessed in developing next‐generation microdevices utilizing the numerous advantages of 3D configurations.