微电子
包装工程
材料科学
光电子学
纳米技术
计算机科学
工程类
工程物理
机械工程
作者
Zhike Zhang,Yu Liu,Jianguo Liu,Na Zhu
出处
期刊:Journal of Semiconductors
[IOP Publishing]
日期:2015-10-01
卷期号:36 (10): 101001-101001
被引量:4
标识
DOI:10.1088/1674-4926/36/10/101001
摘要
Compared with microelectronic packaging, optoelectronic packaging as a new packaging type has been developed rapidly and it will play an essential role in optical communication. In this paper, we try to summarize the development history, research status, technology issues and future prospects, and hope to provide a meaningful reference.
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