Enhanced Heat Dissipation and Reduced Power Consumption in Electronics Using 2D Hexagonal Boron Nitride

Abstract Miniaturization of electronic components has led to overheating, increased power consumption, and early circuit failures. Conventional heat dissipation methods are becoming inadequate due to limited surface area and higher short‐circuit risks. This study presents a fast, low‐cost, and scalable technique using 2D hexagonal boron nitride (hBN) coatings to enhance heat dissipation in commercial electronics. Inexpensive hBN layers, applied by drop casting or spray coating, boost thermal conductivity at IC surfaces from below 0.3 to 260 W m −1 K −1 , resulting in over double the heat flux and convective heat transfer. This significantly reduces operating temperatures and power consumption, as demonstrated by a 17.4% reduction in a coated audio amplifier circuit board. Density functional theory indicates enhanced interaction between 2D hBN and packaging materials as a key factor. This approach promises substantial energy and cost savings for large‐scale electronics without altering existing manufacturing processes.