材料科学
热塑性弹性体
铜
X射线光电子能谱
弹性体
无定形固体
复合材料
图层(电子)
聚合物
化学工程
冶金
共聚物
有机化学
化学
工程类
作者
Huiyuan Zhang,Rui Xu,Tao Zhou
标识
DOI:10.1002/adem.202301715
摘要
Laser direct structuring (LDS) technology successfully realized the selective metallization on thermoplastic elastomers. Polystyrene‐ block ‐poly(ethylene‐ co ‐propylene‐ block ‐polystyrene copolymer (SEPS) and polyether‐ block ‐amide (Pebax) containing 5 wt% Cu 2 (OH)PO 4 are designed as LDS materials. Copper layers are obtained after NIR laser activation and metallization. The analysis of morphologies (optical microscope, scanning electron microscopy, confocal laser scanning microscopy), the chemical composition (X‐ray photoelectron spectroscopy [XPS], Raman, X‐ray diffraction), and the performance (scotch tape test, resistance) of materials before and after laser activation and metallization are carried out. The key to obtaining a high‐quality metal layer is as follows. 1) Cu 2+ is reduced to copper (Cu 0 ) with amorphous carbon acting as a reducing agent, and Cu 0 acts as catalyst seeds in metallization. 2) The good adhesion between polymers and copper layers comes from the micropores etched by laser activation. In particular, XPS shows that 64.6% Cu 2+ in SEPS/Cu 2 (OH)PO 4 is reduced to Cu 0 , while only 18.4% Cu 2+ in Pebax/Cu 2 (OH)PO 4 is reduced after laser activation. Moreover, resistances of copper layers on SEPS/Cu 2 (OH)PO 4 and Pebax/Cu 2 (OH)PO 4 are 0.96 and 5.04 Ω, respectively. This study puts forward a way of fabricating flexible LDS materials. The prepared SEPS/Cu 2 (OH)PO 4 composite is promising for shape variable decoration and flexible electronic devices.
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