In situ correlative observation of humping-induced cracking in directed energy deposition of nickel-based superalloys

材料科学 高温合金 波纹度 开裂 同步加速器 表面粗糙度 激光器 光学 复合材料 合金 物理
作者
Tristan G. Fleming,David Tien Rees,Sebastian Marussi,Thomas Connolley,Robert Atwood,Martyn A. Jones,James M. Fräser,Chu Lun Alex Leung,Peter Lee
出处
期刊:Additive manufacturing [Elsevier]
卷期号:71: 103579-103579 被引量:16
标识
DOI:10.1016/j.addma.2023.103579
摘要

Directed energy deposition (DED) is a promising additive manufacturing technique for repair; however, DED is prone to surface waviness (humping) in thin-walled sections, which increases residual stresses and crack susceptibility, and lowers fatigue performance. Currently, the crack formation mechanism in DED is not well understood due to a lack of operando monitoring methods with high spatiotemporal resolution. Here, we use inline coherent imaging (ICI) to optically monitor surface topology and detect cracking in situ, coupled with synchrotron X-ray imaging for observing sub-surface crack healing and growth. For the first time, ICI was aligned off-axis (24° relative to laser), enabling integration into a DED machine with no alterations to the laser delivery optics. We achieved accurate registration laterally (<10 µm) and in depth (<3 µm) between ICI measurements and the laser beam position using a single-element MEMS scanner and a custom calibration plate. ICI surface topology is verified with corresponding radiographs (correlation >0.93), directly tracking surface roughness and waviness. We intentionally seed humping into thin-wall builds of nickel super-alloy CM247LC, locally inducing cracking in surface valleys. Crack openings as small as 7 µm were observed in situ using ICI, including sub-surface signal. By quantifying both humping and cracking, we demonstrate that ICI is a viable tool for in situ crack detection.

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