Research on ceramic package for high temperature electronic devices

This paper firstly introduces the research progress of ceramic packaging for high temperature electronic devices, then the high temperature performance of the traditional ceramic package was investigated. The research results show that the performance of traditional ceramic package will change significantly in high temperature environments. As the temperature increases, the parasitic parameters of the package will increase, which may not meet the needs of the device. Long-term high temperature environment will also cause discoloration of the plating. These problems will affect the electrical performance stability and mechanical reliability of the device, and make the packaged device or circuit fail. It is proposed to develop a new metallization system and material system to study the matching of ceramics and special metals and the high temperature testing technology of ceramic package, improve the temperature stability of its parasitic parameters, and realize electrical performance testing in high temperature environments.