异质结双极晶体管
地平面
低噪声放大器
带宽(计算)
光电子学
放大器
电气工程
基质(水族馆)
材料科学
噪声系数
电子工程
物理
CMOS芯片
电信
工程类
晶体管
双极结晶体管
地质学
电压
天线(收音机)
海洋学
作者
Vikas Singh Chauhan,Nadine Collaert,Piet Wambacq
标识
DOI:10.1109/lmwc.2022.3189607
摘要
This letter presents a $D$ -band low-noise amplifier (LNA) in 250-nm InP HBT technology for the next-generation wireless applications. The LNA has a measured peak gain of 13 dB, a 3-dB bandwidth greater than 20 GHz (120–140 GHz), and a measured noise figure (NF) of less than 6 dB in the band. A reduction in the 3-dB bandwidth from simulation was observed during the measurements which was attributed to the substrate waves using full chip electromagnetic (EM) simulation. EM simulations show that a partial or complete removal of the back side metallization of the InP substrate, holes in metal-1 ground plane, or a strategic placement of through-substrate vias suppress these substrate waves. To the authors' knowledge, this is the first 120–140-GHz LNA in the InP 250-nm HBT technology.
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