Mitigation of self-heating in AlGaN/GaN HEMTs using transferred LPCVD-grown h-BN

With the increasing power density of GaN-based power devices, the self-heating effect has become a significant bottleneck, impacting device reliability and performance, which makes effective thermal management essential. Hexagonal boron nitride (h-BN), with its high thermal conductivity and excellent electrical insulation, offers a promising solution for heat dissipation. In this Letter, we demonstrate that the transferred low-pressure chemical vapor deposition-grown h-BN effectively mitigates self-heating in AlGaN/gallium nitride high electron mobility transistors. All 12 tested devices showed increased current after BN transfer. The average current density in the saturation region improved from 819 to 924 mA/mm, and the current retention rose from 89% to 98%. Thermo-reflectance measurements revealed a significant reduction in channel temperature from 179 to 115 °C under a power density of 21 W/mm. The improvement is attributed to the high in-plane thermal conductivity of h-BN, which is proven by the hotspot models. This approach shows promise as a practical method to reduce self-heating and enhance the thermal reliability of GaN-based power transistors.