材料科学
复合材料
纳米复合材料
电磁屏蔽
石墨烯
电介质
复合数
纳米颗粒
电磁干扰
热导率
纳米技术
电子工程
光电子学
工程类
作者
Yang Pan,Bin Yang,Ning Jia,Yuqing Yang,Yang Wang,Nuo Zhang,Ru Xia,Jiasheng Qian,Siyu Wang,Youlei Tu,You Shi,Yirong Fang
标识
DOI:10.1002/mame.202200220
摘要
Abstract Here, Ni@graphene nanoplatelet (GNP) nanohybrids are obtained via an interfacial reaction growth method and a series of poly(methyl methacrylate) (PMMA)/Ni@GNP composites are prepared by a solution mixing‐ultrasonic dispersion‐hot pressing technology. The influence of Ni@GNP on the electromagnetic interference (EMI) shielding, dielectric, and thermal management behaviors of the composites is intensively investigated. The microcapacitors formed using Ni@GNP as plates and PMMA as matrix significantly improve the dielectric properties of the composites. Enhancement on thermal conduction and EMI properties of PMMA composites with increasing Ni@GNP content can be ascribed to the unique structure of Ni@GNP and it is the filler interconnection network that renders the composite's desirable thermally conductive and thermomechanical properties. A facile way of fabricating polymeric composites with satisfactory thermal conductivity and high‐performance electromagnetic shielding is provided here. The obtained polymer composites display highly promising applications in the thermal management and EMI shielding of electronic devices.
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