晶体管
集成电路
电子线路
数字电子学
过程(计算)
电子工程
数码产品
纳米技术
材料科学
电气工程
计算机科学
工程类
电压
操作系统
作者
Anhan Liu,Xiaowei Zhang,Ziyu Liu,Yuning Li,Xueyang Peng,Xin Li,Yuwen Qin,Changwei Hu,Yanqing Qiu,Han Jiang,Yang Wang,Yifan Li,Jun Tang,Jun Li,Hao Guo,Tao Deng,Songang Peng,He Tian,Tian‐Ling Ren
标识
DOI:10.1007/s40820-023-01273-5
摘要
Abstract Due to the constraints imposed by physical effects and performance degradation, silicon-based chip technology is facing certain limitations in sustaining the advancement of Moore’s law. Two-dimensional (2D) materials have emerged as highly promising candidates for the post-Moore era, offering significant potential in domains such as integrated circuits and next-generation computing. Here, in this review, the progress of 2D semiconductors in process engineering and various electronic applications are summarized. A careful introduction of material synthesis, transistor engineering focused on device configuration, dielectric engineering, contact engineering, and material integration are given first. Then 2D transistors for certain electronic applications including digital and analog circuits, heterogeneous integration chips, and sensing circuits are discussed. Moreover, several promising applications (artificial intelligence chips and quantum chips) based on specific mechanism devices are introduced. Finally, the challenges for 2D materials encountered in achieving circuit-level or system-level applications are analyzed, and potential development pathways or roadmaps are further speculated and outlooked.
科研通智能强力驱动
Strongly Powered by AbleSci AI