拓扑优化
散热片
拓扑(电路)
计算机科学
机械工程
工程制图
工程类
数学优化
结构工程
有限元法
数学
电气工程
作者
Dingbao Wang,Chen Yang,Guanghui Wang,Yi Li,Talib Dbouk
摘要
Abstract Topology optimization (TO) method is developed and applied to 3D heat sinks design optimization using the finite element method (FEM). To go from theory to practical application of optimized heat sink designs, the impact of the ratio between fin height (Hc) and substrate thickness (Hb) on the performance of heat sinks was investigated, studying the critical role of geometric parameters in heat dissipation performance, focusing on optimizing the internal fluid channels to enhance the overall hydraulic and thermal efficiencies under various operating conditions. Optimal flow conditions vary across TO designs; notably, structures with near-equal (Hc) and (Hb) ratios demonstrated superior energy and fluid flow overall performances. At high Reynolds numbers, the optimized heat sink designs showed an enhancement in the overall performance up to 41.2%, show- casing the effectiveness of the present TO method. The new 3D optimal designs can be applied to different applications such as the cooling of CPU, GPU and different electronic chips.
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