Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds

Wired Just as there are difficulties in making integrated circuits smaller and faster, barriers are also being reached in the fabrication of wires that connect chips to the motherboard. Hu and Yu (p. 313 ) describe the directed electrodeposition and bonding of copper and platinum wires via a meniscus delivered from a micropipette containing a deposition solution. Wires could be deposited on a range of substrates and were significantly smaller than those obtained using existing techniques. This approach may be useful for device packaging and might offer new approaches for constructing tailored nanoscale structures.