Preparation of Porous Current Collector with a Compact Cross‐Linked Structure

Abstract Lightweight copper coated porous polyimide (PI) current collector (CC) with compact cross‐linked structure was prepared through electroless plating method. Porous cross‐linked PI substrate with different Cu loading was obtained by controlling concentration of electroless plating bath. FTIR, XRD, and SEM was characterized to investigate their chemical structure and morphology. Furthermore, the electrode which was used with the copper coated porous PI CC and commercial planar Cu foil CC was prepared. Their rate performance and cycle performance were carried out and compared. It indicated that the lightweight porous Cu coated bPI as CC show a good performance.