材料科学
热导率
复合材料
微电子
聚合物
热的
造型(装饰)
保温
纳米技术
物理
图层(电子)
气象学
作者
Fan Zhu,Zi Min Fan,Lei Zhang,Yu Feng Wang
出处
期刊:Materials Science Forum
日期:2022-02-24
卷期号:1054: 111-116
被引量:3
摘要
The heat dissipation of electronic components is of great importance to the development of microelectronics industry. Polymer matrix composites have become a research hotspot due to their advantages in molding, insulation and cost. In this paper, the mechanism and influencing factors of thermal conductivity of polymer matrix composites are introduced, the research status of thermal network formation is reviewed, and the development trend of thermal conductivity composites is forecasted.
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