期刊:IEEE Electron Device Letters [Institute of Electrical and Electronics Engineers] 日期:2019-10-16卷期号:40 (12): 1949-1952被引量:34
标识
DOI:10.1109/led.2019.2947762
摘要
In this letter, high-performance thin-film transistors (TFTs), with indium oxide (In 2 O 3 ) as front channel layer, high permittivity ZrO 2 as dielectric layer, and aluminum oxide (Al 2 O 3 ) as passivation layers were integrated by a fully solution process. It is found that the incorporation of Al 2 O 3 passivation layer gives rise to a sharp decrease in the off current (I off ) and a corresponding increase in the on/off current ratio (I on /I off ) of the TFTs, compared to that without Al 2 O 3 passivation. Furthermore, the thickness effect of the passivation layer on the performance of In 2 O 3 /ZrO 2 TFTs has been investigated systematically. The In 2 O 3 /ZrO 2 TFTs with optimized Al 2 O 3 passivation layers can be operated at 3 V with high performance, including a high field-effect mobility of 21.22 cm 2 N s, a large I on /I off of 10 7 and a negligible hysteresis (~0 V). This work demonstrates an effective strategy for the construction of high performance TFTs by incorporating the passivation layer.