A study of direct writing conductive lines by laser etching

In this paper, a new approach for laser direct etching thick film conductive pastes to generate conductive lines on glass and ceramic substrates was reported so as to improve the currunt thick-film circuit production technology. A YAG laser with the wavelength 1.06 µm and pulsed width several hundrands ns is used to etch conductive pastes. The effect oflaser fluence, repetition rates and laser scanning speed on the width and boundary performance of conductive lines is analyzed, based on which the optimal machining parameters are recommended. The experimental results demonstrated that the fabricated conductive lines have excellent line quality, such as clean line bottoms, smooth edges and narrow line width..