材料科学
烧结
复合材料
收缩率
陶瓷
铁氧体(磁铁)
复合数
电介质
流延
堆积
核磁共振
光电子学
物理
作者
Xuemin Cui,Ji Zhou,Bo Li,Zhangfa Tong
标识
DOI:10.1080/10426910601134088
摘要
Abstract This paper presents the co-firing behavior and interfacial structure of BaO–TiO2–B2O3–SiO2 glass–ceramics/NiCuZn ferrite multi-layer composites. Several effective methods, such as sandwich stacking structure and sintering shrinkage modification, are proposed to prevent the camber problem due to the mismatched shrinkage during sintering process to fabricate high-frequency chip inductors that are composite by NiCuZn ferrite and dielectric glass ceramic. Keywords: Glass–ceramicInductorInterfacesLaminationLTCC (low-temperature co-fired ceramics)MicrostructureMulti-layered chipMulti-layersResidual stressesSintering shrinkageTape castingThermal expansion coefficientsThermo-mechanical analysis ACKNOWLEDGMENTS This work was supported by the Ministry of Sciences and Technology of China through a High-Tech R&D Program (863 Program) in the form of a grant numbered as 2003AA32G030, and also a Key Based Research Program (973 Program) as a grant with the number as 2002CB613306.
科研通智能强力驱动
Strongly Powered by AbleSci AI