陶瓷电容器
材料科学
印刷电路板
电极
图层(电子)
电压降
保形涂层
电容器
复合材料
涂层
焊接
阳极
表面贴装技术
电压
陶瓷
光电子学
电子工程
电气工程
工程类
物理化学
化学
作者
Young‐Ran Yoo,Seokyeon Won,Young Sik Kim
出处
期刊:Coatings
[Multidisciplinary Digital Publishing Institute]
日期:2024-03-18
卷期号:14 (3): 359-359
被引量:2
标识
DOI:10.3390/coatings14030359
摘要
A large amount of multi-layer ceramic capacitor (MLCC) is mounted inside a printed circuit board (PCB) constituting electronic components. The use of MLCC in electric vehicles and the latest mobile phones is rapidly increasing with the latest technology. Environments in which electronic components are used are becoming more diverse and conformal coatings are being applied to protect mounted components from these environments. In particular, MLCCs in electronic components mainly have voltage applied. They might be used in environments where humidity exists for various reasons. In a humid environment, electrochemical migration (ECM) will occur, with the cathode and anode on the surface of the MLCC encountering each other. This can result in product damage due to a short circuit. In this study, the effects of voltage, NaCl concentration, and distance between electrodes on a non-mount MLCC, surface mount MLCC, and solder pad pattern were evaluated using a water drop test (WDT). Based on the analysis of the effects of the presence of conformal coating, applied voltage, concentration of NaCl, and the distance between electrodes, a mechanism model for ECM behavior in MLCCs was proposed.
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