材料科学
合金
微观结构
降水
相(物质)
晶界
扩散
热稳定性
粒度
冶金
复合材料
热力学
化学工程
化学
物理
工程类
有机化学
气象学
作者
Pinhui Lv,Richu Wang,Chaoqun Peng,Zhiyong Cai,Yan Feng,Xiang Peng
标识
DOI:10.1016/j.jmrt.2023.11.078
摘要
The thermal stability of Al–Cu–Li alloy is critical to the quality and reliability of aerospace structural components. In this work, the microstructure and properties of rapidly solidified Al–Cu–Li alloy (T84) thermally exposed at 150 °C, 175 °C, 200 °C and 225 °C for 500 h were systematically studied. The results show that the T84 alloy exhibits excellent thermal stability with increased strength after thermally exposed at 150 °C, which is attributed to the increased number density of the T1 phase -Al2CuLi. With the further increase of thermal exposure temperature, the size of the T1 phase increases, the number density decreases significantly, and coarse precipitates such as T2 phase-Al6CuLi3 are formed. Meanwhile, the grain boundary precipitates coarsen and the precipitation free zones widen. The strengthening mechanism of the T1 phase transforms from shear mechanism to by-passing mechanism, and its contribution to yield strength decreases dramatically. In addition, the calculated activation energy indicates that coarsening of the T1 phase is controlled by the diffusion of Cu atoms.
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