碳化硅
材料科学
薄脆饼
反演(地质)
硅
透射电子显微镜
工程物理
凝聚态物理
光电子学
纳米技术
复合材料
地质学
物理
构造盆地
古生物学
作者
Emilio Scalise,Massimo Zimbone,Anna Marzegalli
标识
DOI:10.1002/pssb.202200093
摘要
Inversion domain boundaries are extended defects affecting cubic silicon carbide (3C‐SiC) layers grown on the on‐axis (001) Si wafers. Their impact on the device performance is still debated and a clear connection to their electronic properties at the atomistic scale is still missing. By comparing the first‐principles atomistic models and scanning transmission electron microscopy imaging, the most relevant structures of inversion domain boundaries laying both in the {110} and {111} planes are identified. Their calculated electronic structures shed light on the relevance that these extended defects may have in the degradation of the performances of the 3C‐SiC devices.
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