Lv4
700 积分 2023-08-24 加入
Chip cooling with manifold-capillary structures enables 105 COP in two-phase systems
6天前
已完结
Thermal Interface Engineering in a 3D-Structured Carbon Framework for a Phase-Change Composite with High Thermal Conductivity
20天前
已完结
A critical review of carbon-based thermal interface materials
1个月前
已完结
Densifying Conduction Networks of Vertically Aligned Carbon Fiber Arrays with Secondary Graphene Networks for Highly Thermally Conductive Polymer Composites
1个月前
已完结
Ultra high thermal conductivity polymer composites
1个月前
已完结
Novel Graphene‐Epoxy Composite with Aligned Architecture and Ultrahigh Thermal Conductivity
1个月前
已完结
Vertically aligned and conformal BN-coated carbon fiber to achieve enhanced thermal conductivity and electrical insulation of a thermal interface material
1个月前
已完结
Densifying Conduction Networks of Vertically Aligned Carbon Fiber Arrays with Secondary Graphene Networks for Highly Thermally Conductive Polymer Composites
1个月前
已完结
Thermal Conductivity of the Materials Based on Silicon Carbide and Silicon Nitride
1个月前
已完结
Advancements in carbon microsphere-based nanocomposites: synthesis, properties and multifaceted applications: a comprehensive review
1个月前
已完结
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