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170 积分 2024-05-23 加入
Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties
3天前
已完结
Air-sinterable copper pastes for next-generation electronics: a review
14天前
已完结
Advances in Low‐Temperature Co‐Fired Ceramics for Next‐Generation Electronics Applications
14天前
已完结
Near‐Theoretical Oxidation Resistance in Copper Powder Enabled by Scalable Plasma‐Assisted Few‐Layer Graphene Encapsulation
1个月前
已完结
An inorganic-organic graded protection strategy via surface phosphating for superior antioxidant and sintering performance of copper pastes
1个月前
已完结
Preparation of Oleic Acid-capped Copper Nanoparticles
1个月前
已完结
Breaking the oxidation chain reaction: Synergistic O2-Blocking layers on copper via stepwise formate-BTA grafting
1个月前
已完结
Improvement of Oxidation Resistance of Ultrafine Copper Powders by Phosphating Treatment
1个月前
已完结
Information for Non-cyanide Copper Plating
1个月前
已关闭
A kinetic study of partial oxidation of methane with nitrous oxide on a molybdena-silica catalyst
7个月前
已完结