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3080 积分 2022-04-28 加入
Comparative effects of plasma treatments on SiO2 surface and bonding performance for wafer and hybrid bonding
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Atomistic bonding and nanoscale separation mechanisms of plasma-activated and hydrated SiCN/SiCN dielectric interfaces for hybrid bonding
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Grain engineering for low-temperature Cu/SiO₂ hybrid bonding: A microstructure-driven thermal expansion model
2个月前
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Quantitative assessment of adhesion strength in hybrid bonded interfaces with varying metal contact density
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Wafer-to-wafer hybrid bonding at 400-nm interconnect pitch
2个月前
已完结
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