Lv6
3090 积分 2022-04-28 加入
Grain engineering for low-temperature Cu/SiO₂ hybrid bonding: A microstructure-driven thermal expansion model
8小时前
已完结
Quantitative assessment of adhesion strength in hybrid bonded interfaces with varying metal contact density
13小时前
已完结
Wafer-to-wafer hybrid bonding at 400-nm interconnect pitch
1天前
已完结
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