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Modern 2D Heterostructures: From Fabrication Challenges to Emerging Applications
7小时前
已完结
Modern 2D Heterostructures: From Fabrication Challenges to Emerging Applications
6天前
已完结
Tungsten Diselenide Transistors: Layer Number Dependence, Channel Passivation and In‐Plane Gates
1个月前
已完结
p-Type 2D transistors from contact physics to complementary integration
1个月前
已完结
Wafer-scale integration of single-crystalline molybdenum disulfide for flexible electronics using oxide dry transfer
4个月前
已完结
Toward Suppression of Bias Instability in Monolayer WSe2 Top-Gate pFETs
4个月前
已完结
CO2‐Assisted Solution‐Phase Selective Assembly of 2D WS2‐WO3⋅H2O and 1T‐2H MoS2 to Desirable Complex Heterostructures
4个月前
已完结
High-performance p-type monolayer tungsten diselenide transistors
4个月前
已完结
Printing, folding and assembly methods for forming 3D mesostructures in advanced materials
5个月前
已完结
Manipulating MoS2 Thickness On‐Chip via Van Der Waals Delamination
6个月前
已关闭