Lv4
568 积分 2022-09-21 加入
Printing, folding and assembly methods for forming 3D mesostructures in advanced materials
19天前
已完结
Manipulating MoS2 Thickness On‐Chip via Van Der Waals Delamination
1个月前
已关闭
Reconfigurable logic transistors with superlubric sliding electrodes
1个月前
已关闭
Wafer-scale dry transfer of graphene via thermally removable Sb2O3 sacrificial layer
1个月前
已关闭
Semimetal-in-oxide design for tellurium-based p-type oxide electronics
1个月前
已完结
Asymmetric contact structure enables fast response of Bi2O2Se photodetectors
1个月前
已完结
Near-zero-adhesion-enabled intact wafer-scale resist-transfer printing for high-fidelity nanofabrication on arbitrary substrates
1个月前
已完结
Review of overlay error and controlling methods in alignment system for advanced lithography
1个月前
已完结
Advanced monolithic integration strategies on wide-bandgap semiconductors: the two-dimensional material heterogeneous integration and the system-level multi-functional integration
7个月前
已完结
Ice-assisted van der Waals metal contact with halide perovskites
7个月前
已完结
皖公网安备34019202002308
