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170 积分 2025-09-15 加入
Progress and critical challenges in slicing of thin semiconductor wafers using ultra-fine diamond wire
24天前
已完结
Slurry pressure at the cutting zone in multi-wire sawing: An experimental study
24天前
已完结
Experimental study on surface topography and fracture strength of worn saw wire in multi-wire sawing
24天前
已关闭
Mechanism and Motion of Semifixed Abrasive Grit for Wire-Saw Slicing
28天前
已关闭
Analysis of structured wire wafering processes to predict optimized process settings by varying particle size and wire diameter
28天前
已关闭
A comprehensive review of diamond wire sawing process for single-crystal hard and brittle materials
1个月前
已完结
Study on the temperature field in the cutting zone for machining monocrystalline silicon wafer using free abrasive multi-wire saw
1个月前
已完结
Surface formation, morphology, integrity and wire marks in diamond wire slicing of mono-crystalline silicon in the photovoltaic industry
1个月前
已完结
Wire-bowin situmeasurements for powerful control of wire-wear during diamond-wire crystalline silicon sawing
1个月前
已完结
Research on an improved bath cooling and lubrication method for diamond wire sawing
2个月前
已完结
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