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246 积分 2025-09-15 加入
Basic Mechanisms and Models of Multi‐Wire Sawing
6天前
已完结
Evaluation of fixed abrasive diamond wire sawing induced subsurface damage of solar silicon wafers
7天前
已完结
Experimental investigation and analysis of the influence of process parameters on the surface quality of micro-shaped abrasive diamond wire saw slicing
25天前
已完结
Motion characteristic and periodic saw mark formation in electroplated diamond wire sawing of monocrystalline silicon wafers
26天前
已完结
Progress and critical challenges in slicing of thin semiconductor wafers using ultra-fine diamond wire
26天前
已完结
Progress and critical challenges in slicing of thin semiconductor wafers using ultra-fine diamond wire
3个月前
已完结
Slurry pressure at the cutting zone in multi-wire sawing: An experimental study
3个月前
已完结
Experimental study on surface topography and fracture strength of worn saw wire in multi-wire sawing
3个月前
已关闭
Mechanism and Motion of Semifixed Abrasive Grit for Wire-Saw Slicing
3个月前
已关闭
Analysis of structured wire wafering processes to predict optimized process settings by varying particle size and wire diameter
3个月前
已关闭
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