Lv4
530 积分 2024-11-22 加入
Novel and fast transient liquid phase bonding using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform
16小时前
已完结
Sn-3.0Ag-0.5Cu/OSP Solder Joints Assembled using Multi-Wavelength Light
16小时前
已完结
Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn–Ag–Cu alloy
5天前
已完结
Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder
7天前
已完结
Effect of TiO2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish
7天前
已完结
Orthogonal design optimization for Cu/Sn58Bi-0.4Mg/Cu solder joint strength in ultrasonic-assisted soldering
17天前
已完结
Significant enhancement of the overall performance of SAC joints by adding cu@Sn@ag core shell particles and ultrasonically assisted soldering
17天前
已完结
Significant enhancement of the overall performance of SAC joints by adding cu@Sn@ag core shell particles and ultrasonically assisted soldering
17天前
已关闭
Significant enhancement of the overall performance of SAC joints by adding cu@Sn@ag core shell particles and ultrasonically assisted soldering
17天前
已关闭
Orthogonal design optimization for Cu/Sn58Bi-0.4Mg/Cu solder joint strength in ultrasonic-assisted soldering
19天前
已关闭
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