Lv3
330 积分 2024-11-22 加入
Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures
3天前
已完结
Investigation on interfacial compound growth kinetics in Sn-0.7Cu/Cu solder joint and mechanism analysis: Experiments and molecular dynamics simulations
4天前
已完结
Microstructure and mechanical properties of 7075-Al alloy joint ultrasonically soldered with Ni-foam/Sn composite solder
1个月前
已完结
Effects of alloying elements on the interfacial segregation of bismuth in tin-based solders
3个月前
已关闭
Effects of SiC nanowires on reliability of Sn58Bi-0.05GNSs/Cu solder joints
5个月前
已完结
Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix
5个月前
已完结
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