Lv4
596 积分 2023-02-23 加入
A comprehensive review of diamond/copper composites for high thermal conductivity applications
2天前
已完结
Collective Die-to-Wafer Bonding of Si Dies and 4-Inch Polycrystalline Diamond Wafer with Ultralow Thermal Boundary Resistance and High Bonding Quality
1个月前
已完结
Biomass‐Derived Carbon With Large Interlayer Spacing for Anode of Potassium Ion Batteries
5个月前
已完结
Preparation of homogeneous SiC coating on diamond particles by magnetron sputtering for diamond/Al composites with high thermal conductivity
5个月前
已完结
Diamond Blankets Will Chill Future Chips: A Micrometers-Thick Integrated Layer Spreads Out the Heat
8个月前
已完结
Moving Towards Microchannel-based Chip Cooling
9个月前
已完结
Thermal management materials for 3D-stacked integrated circuits
10个月前
已完结
A Review of the Cu CMP Process in Hybrid Bonding Technology
10个月前
已完结
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