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40 积分 2023-12-08 加入
Plasma-Activated Copper-Alkanolamine Precursor Paste for Printed Flexible Antenna: Formulation, Mechanism, and Performance Evaluation
21天前
已完结
Non‐Noble‐Metal‐Based Electrocatalysts for Acidic Oxygen Evolution Reaction: Recent Progress, Challenges, and Perspectives
4个月前
已完结
Progress of Nonprecious‐Metal‐Based Electrocatalysts for Oxygen Evolution in Acidic Media
4个月前
已完结
Preparation of tin-coated copper powders by chemical reduction
5个月前
已完结
Low-temperature Copper Sinter-joining Technology for Power Electronics Packaging: A Review
7个月前
已完结
Polymer Hybrid Bonding using Copper-Copper Bonding Materials and Thermosetting Resins for Copper-Copper Bonding at 200–250 °C
7个月前
已完结
Progress in Developing Highly Efficient p-Type TCOs for Transparent Electronics: A Comprehensive Review
7个月前
已完结
A comparative study of chemisorption by density functional theory, ab initio, and semiempirical methods: carbon monoxide, formate, and acetate on Cu(110)
8个月前
已完结
Spectroscopic Observation of Reversible Surface Reconstruction of Copper Electrodes under CO2 Reduction
8个月前
已完结
The rates of oxidation of several faces of a single crystal of copper as determined with elliptically polarized light
8个月前
已完结
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