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40 积分 2023-10-12 加入
Thermal management materials for 3D-stacked integrated circuits
3个月前
已完结
Highly thermoconductive and mechanically robust boron nitride/aramid composite dielectric films from non-covalent interfacial engineering
9个月前
已完结
Construction of boron nitride nanosheets-based nanohybrids by electrostatic self-assembly for highly thermally conductive composites
9个月前
已完结
Review of Nanocomposite Dielectric Materials With High Thermal Conductivity
10个月前
已完结
Taking dynamic covalent chemistry out of the lab and into reprocessable industrial thermosets
11个月前
已完结
Reprocessable and ultratough epoxy thermosetting plastic
11个月前
已完结
Reprocessable and ultratough epoxy thermosetting plastic
1年前
已完结
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