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20 积分 2025-03-28 加入
Influence of crystal orientation and incident plane on n-type 4H-SiC wafer slicing by using picosecond laser
1个月前
已完结
Cold Split Kerf-Free Wafering Results for Doped 4H-SiC Boules
4个月前
已完结
Improved Two-Temperature Model and Its Application in Ultrashort Laser Heating of Metal Films
7个月前
已完结
Erratum: “Thermoplastic deformation of silicon surfaces induced by ultrashort pulsed lasers in submelting conditions” [J. Appl. Phys. 111, 053502 (2012)]
8个月前
已完结
Laser heating of semiconductors—effect of carrier diffusion in nonlinear dynamic heat transport process
10个月前
已完结
Picosecond pulsed laser ablation and micromachining of 4H-SiC wafers
10个月前
已完结
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