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160 积分 2025-08-21 加入
Tutorial: Fundamentals of Circuit Design for 2.5D/3D Integration
5天前
已关闭
Developmnet of a robust Ultra-Low-k film and carbon replenishment for reliable BEOL interconnect
2个月前
已完结
Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
2个月前
已完结
Deposition of ALD-Molybdenum for Flash Memory Wordline Metallization
6个月前
已完结
Sol-gel dip-coating of yttrium oxide films with eco-friendly additives for enhanced plasma-resistant coatings
8个月前
已关闭
Quantum Ornstein-Zernike theory for two-temperature two-component plasmas
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