Lv31
280 积分 2026-02-01 加入
低翘曲BGA封装用环氧塑封料开发与应用
17天前
已完结
光电耦合器封装用环氧塑封料的制备
17天前
已完结
高导热环氧模塑料的制备
17天前
已完结
Research on packaging damage and final failure of large-scale plastic-encapsulated power module under thermal stress
1个月前
已完结
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging
1个月前
已完结
Ultrahigh-solid-content silica/epoxy composite for high-performance semiconductor packaging
2个月前
已完结
Thermomechanical, mechanical, and physical characterization study of epoxy molding compound of memory packages under high-temperature aging
2个月前
已完结
Effects of Glass Transition Temperature and Molecular Structure of Bio-Epoxy on Epoxy Molding Compound Applications for Integrated Circuit Packaging
2个月前
已完结
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