Lv4
610 积分 2023-02-13 加入
Constitutive relation and creep-fatigue life model for eutectic tin-lead solder
14小时前
已完结
Fatigue properties of lead-free solder joints in electronic packaging assembly investigated by isothermal cyclic shear fatigue
14小时前
已完结
Experimental and Numerical Evaluation of SnAgCu and SnPb Solders Using a MicroBGA Under Accelerated Temperature Cycling Conditions
14小时前
待确认
Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections
14小时前
已完结
The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor
14小时前
已完结
Study on fatigue ductility coefficient and life prediction for mixed solder joints under thermal cycle loads
14小时前
已完结
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints
14小时前
已完结
Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability
14小时前
已完结
A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint
14小时前
已完结
An Analytical Elasto-Creep Model of Solder Joints in Leadless Chip Resistors: Part 2—Applications in Fatigue Reliability Predictions for SnPb and Lead-Free Solders
14小时前
已完结
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