Lv5
1042 积分 2023-02-02 加入
Glass-molded optical interposers for wafer scale photonic integrated circuit packaging in 800G modules and co-packaged optics
28天前
已完结
AIM Photonics Demonstration of a 300 mm Si Photonics Interposer
1个月前
已完结
A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres
1个月前
已完结
Advanced 2.5D and 3D packaging technologies for next generation Silicon Photonics in high performance networking applications
1个月前
已完结
Beyond CPO: A Motivation and Approach for Bringing Optics Onto the Silicon Interposer
1个月前
已完结
Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect
1个月前
已完结
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
1个月前
已完结
Recent Advances and Trends in Advanced Packaging
1个月前
已完结
Integrated optical frequency comb technologies
3个月前
已完结
Generation, development, and application of microcombs
3个月前
已关闭
皖公网安备34019202002308
