Lv5
1032 积分 2023-02-02 加入
Corrugation-pitch-modulated phase-shifted DFB laser
1个月前
已完结
Glass-molded optical interposers for wafer scale photonic integrated circuit packaging in 800G modules and co-packaged optics
4个月前
已完结
AIM Photonics Demonstration of a 300 mm Si Photonics Interposer
4个月前
已完结
A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres
4个月前
已完结
Advanced 2.5D and 3D packaging technologies for next generation Silicon Photonics in high performance networking applications
4个月前
已完结
Beyond CPO: A Motivation and Approach for Bringing Optics Onto the Silicon Interposer
4个月前
已完结
Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect
4个月前
已完结
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
4个月前
已完结
Recent Advances and Trends in Advanced Packaging
4个月前
已完结
Integrated optical frequency comb technologies
7个月前
已完结
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