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264 积分 2024-07-25 加入
A high-performance nano-copper paste with good oxidation resistance
2个月前
已完结
Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging
2个月前
已完结
Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
2个月前
已完结
Rationalizing the Grain Size Dependence of Strength and Strain-Rate Sensitivity of Nanocrystalline fcc Metals
2个月前
已完结
Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles
4个月前
已完结
Improving thermal stability and reliability of power chips by sintering foam structure layer
4个月前
已完结
Comparative research on atomic diffusion of diamond/Ni and MWCNTs/Ni interfaces with molecular dynamics and experimental methods
4个月前
已完结
Evaluation and thermal ageing of power semiconductor die attachments based on porous film electrodeposition
4个月前
已完结
Evaluation of Thermocompressed Nanoporous Copper Deposit to Replace Soldering for Power Electronic Metal Foam Heat Sinks
4个月前
已完结
Evaluation of thermocompressed nanoporous copper deposit to replace soldering for power electronic metal foam heat sinks
4个月前
已完结
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