Lv31
286 积分 2024-07-25 加入
Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
1小时前
待确认
Rationalizing the Grain Size Dependence of Strength and Strain-Rate Sensitivity of Nanocrystalline fcc Metals
1小时前
求助中
Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles
1个月前
已完结
Improving thermal stability and reliability of power chips by sintering foam structure layer
1个月前
已完结
Comparative research on atomic diffusion of diamond/Ni and MWCNTs/Ni interfaces with molecular dynamics and experimental methods
2个月前
已完结
Evaluation and thermal ageing of power semiconductor die attachments based on porous film electrodeposition
2个月前
已完结
Evaluation of Thermocompressed Nanoporous Copper Deposit to Replace Soldering for Power Electronic Metal Foam Heat Sinks
2个月前
已完结
Evaluation of thermocompressed nanoporous copper deposit to replace soldering for power electronic metal foam heat sinks
2个月前
已完结
Thermal Efficiency Evaluation after Thermocompression of Copper Layer Obtained By Dynamic Hydrogen Bubble
2个月前
已关闭
Electrochemical control of the morphology and functional properties of hierarchically structured, dendritic Cu surfaces
2个月前
已完结
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