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294 积分 2024-07-25 加入
Synthesis and Characterization of Copper Dendritic Structures Obtained by Electrocrystallization at High Current Density
21天前
已完结
Direct formation of Cu nano-dendritic structure on substrate by dynamic hydrogen bubble template for organic-free sintered Cu-to-Cu bonding
1个月前
已完结
A high-performance nano-copper paste with good oxidation resistance
4个月前
已完结
Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging
4个月前
已完结
Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
4个月前
已完结
Rationalizing the Grain Size Dependence of Strength and Strain-Rate Sensitivity of Nanocrystalline fcc Metals
4个月前
已完结
Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles
6个月前
已完结
Improving thermal stability and reliability of power chips by sintering foam structure layer
6个月前
已完结
Comparative research on atomic diffusion of diamond/Ni and MWCNTs/Ni interfaces with molecular dynamics and experimental methods
6个月前
已完结
Evaluation and thermal ageing of power semiconductor die attachments based on porous film electrodeposition
6个月前
已完结
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