Lv11
100 积分 2024-07-25 加入
Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage
5小时前
已完结
Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding
5小时前
待确认
High performance Cu sintering joint for power devices enabled by in-situ generation of Cu particles with multi-level hierarchical structures
5小时前
已完结
Employing perforated copper foam to improve the thermal performance of latent thermal energy storage units
4个月前
已完结
Improving thermal stability and reliability of power chips by sintering foam structure layer
4个月前
已完结
On shock response of nano-void closed/open cell copper material: Non-equilibrium molecular dynamic simulations
4个月前
已完结
Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging
4个月前
已完结
Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging
5个月前
已完结
Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging
5个月前
已完结
Improving thermal stability and reliability of power chips by sintering foam structure layer
5个月前
已完结
皖公网安备34019202002308
