Lv1
6 积分 2023-02-06 加入
On-the-fly machine learning force field generation: Application to melting points
3个月前
已完结
Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400°C for through silicon via application
3个月前
已完结
Performance and reliability analysis of redistribution layers under interfacial crack
3个月前
已关闭
Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements
3个月前
已完结
Brief overview of the impact of thermal stress on the reliability of through silicon via: Analysis, characterization, and enhancement
3个月前
已完结
Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection
3个月前
已完结
Thermo-Mechanical Reliability of TSV based 3D-IC
3个月前
已关闭
Reliability Study of Critical Structural Redistribution Layers in Advanced Packaging: A Review
3个月前
已完结
Electromigration in three-dimensional integrated circuits
3个月前
已完结
First-principles high-throughput screening of bulk piezo-photocatalytic materials for sunlight-driven hydrogen production
4个月前
已完结
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