Lv11
10 积分 2023-02-06 加入
The influence of amorphous TaNx under-layer on the crystal growth of over-deposited Ta film
3小时前
已完结
Effect of thickness scaling on the permeability and thermal stability of Ta(N) diffusion barrier
3小时前
已完结
Electrical Reliability Issues of Integrating Thin Ta and TaN Barriers with Cu and Low‐K Dielectric
3小时前
已完结
Characterization of “Ultrathin-Cu”/Ru(Ta)/TaN Liner Stack for Copper Interconnects
3小时前
已完结
The contact resistance reduction of Cu interconnects by optimizing the crystal behavior of Ta/TaN diffusion barrier
4小时前
已完结
Behavior of thin Ta-based films in the Cu/barrier/Si system
4小时前
已完结
Interface stability and microstructure of an ultrathin α-Ta/graded Ta(N)/TaN multilayer diffusion barrier
4小时前
已完结
Accuracy of exchange-correlation functionals and effect of solvation on the surface energy of copper
1个月前
已完结
Interfacial thermal resistance: Past, present, and future
2个月前
已完结
Low temperature characterization of silicon CMOS devices
2个月前
已完结
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