Lv4
710 积分 2023-10-12 加入
Thermal stability issue of ultrathin Ti-based silicide for its application in prospective DRAM peripheral 3D FinFET transistors
13小时前
待确认
Multiring Circular Transmission Line Model for Ultralow Contact Resistivity Extraction
13小时前
已完结
Titanium (germano-)silicides featuring 10−9Ω·cm2contact resistivity and improved compatibility to advanced CMOS technology
16小时前
已完结
Open DRAM Model—Part II: Enabling Processing-in-Memory in 3-D DRAM
1个月前
已完结
Open DRAM Model—Part I: Cross-Layer Device, Array, and Circuit Analysis With BL-to-BL Coupling Mitigation for 4F 2 VCT DRAM
1个月前
已完结
Monolithically Stackable 1T1C 3-D DRAM: A Technical Survey
1个月前
已完结
Monolithic 3D Stackable DRAM
1个月前
已完结
Memory Technology: Enabling the AI Revolution
1个月前
已完结
Comprehensive Analysis of Floating-Body Effect and Data Retention in the Next Generation DRAM Cell
1个月前
已完结
Quantitative Analysis of On-Current Discrepancy Between Monocrystalline Si and IGZO Channels in Stacked 3D-DRAM Transistors
1个月前
已完结
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