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392 积分 2025-11-04 加入
Effects of 2,2-Dithiodipyridine as a Leveler for Through-Holes Filling by Copper Electroplating
5小时前
已完结
A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickening
1个月前
已完结
Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating
1个月前
已完结
Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications
1个月前
已完结
Microvia filling by copper electroplating using diazine black as a leveler
1个月前
已完结
Quaternary ammonium-based levelers for high-speed microvia filling via Cu electrodeposition
1个月前
已完结
Competitive adsorption between bromide ions and bis(3-sulfopropyl)-disulfide for Cu microvia filling
1个月前
已完结
2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating
1个月前
已完结
Filling mechanism in microvia metallization by copper electroplating
1个月前
已完结
Roles of Chloride Ion in Microvia Filling by Copper Electrodeposition
1个月前
已完结
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