Lv41
470 积分 2025-11-04 加入
Effects of additives on via filling and pattern plating with simultaneous electroplating
1小时前
求助中
Unraveling the defect-free blind via filling mechanism in PCBs by a dual-functional monocomponent additive: in situ molecular spectroscopy and DFT validation
1小时前
已完结
Evaluating copper plating process for filling micro vias with thin surface Cu by the 1-(4-carboxyphenyl)-5-mercapto-1H-tetrazole additive
2小时前
已完结
Study of 5-Alkynylpyrimidines as Cobalt Superfilling Inhibitors
2小时前
已完结
Factors governing filling of blind via and through hole in electroplating
2小时前
已完结
Innovative Advances in Copper Electroplating for IC Substrate Manufacturing
2小时前
已完结
Tween Compounds as Eco-Friendly Suppressors for Acid Copper Electroplating Applications of Microvia
2小时前
待确认
The synergistic effects of additives on the micro vias copper filling
2小时前
已完结
Sequential combination of photocatalysis and microalgae technology for promoting the degradation and detoxification of typical antibiotics
2个月前
已完结
Construction of Flower-Like NiO@ASPNTs/C Nanocomposites with Enhanced Lithium Storage Performance as Anodes for Lithium-Ion Batteries
3个月前
已完结
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