Lv11
40 积分 2025-06-18 加入
Direct preparation of diamond heat dissipation microchannel assemblies by picosecond laser
5小时前
已完结
Enhancing heat transfer across metal/diamond interfaces with a graphene interlayer
5小时前
已完结
Enabling record-high heat flux in wide-bandgap electronics via in-chip microfluidic cooling on diamond substrates
4天前
已完结
Magnetic Alignment Meets Phase Separation: Fabricating Flexible Graphite/Silicone Rubber Films with High Through-plane Thermal Conductivity
5天前
已完结
Heat dissipation limit and scenario adaptability of parallel two-phase cold plates for high-power GPUs
6天前
已关闭
High-efficiency heat sink design via SLM-processed diamond TPMS CuCrZr alloy: Optimizing thermal-fluid performance through volume fraction control
6天前
已完结
Enhancing heat transfer across metal/diamond interfaces with a graphene interlayer
6天前
已关闭
Scalable Graphene Fiber Arrays for Superior Thermal Interface Materials with High Reliability
7天前
已完结
Manufacturing-constrained multi-objective optimization of diamond microchannel heat sinks via interpretable machine learning
7天前
已完结
Topology optimization-devised tri-material liquid cooling plate for energy storage battery thermal management
8天前
已关闭
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