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40 积分 2025-06-18 加入
Diamond ICP-DRIE Etching with Pecvd SiO2 Thick Masks and its Application on Microchannel Cooling
2天前
已完结
Direct preparation of diamond heat dissipation microchannel assemblies by picosecond laser
4天前
已完结
Enhancing heat transfer across metal/diamond interfaces with a graphene interlayer
4天前
已完结
Enabling record-high heat flux in wide-bandgap electronics via in-chip microfluidic cooling on diamond substrates
8天前
已完结
Magnetic Alignment Meets Phase Separation: Fabricating Flexible Graphite/Silicone Rubber Films with High Through-plane Thermal Conductivity
9天前
已完结
Heat dissipation limit and scenario adaptability of parallel two-phase cold plates for high-power GPUs
10天前
已关闭
High-efficiency heat sink design via SLM-processed diamond TPMS CuCrZr alloy: Optimizing thermal-fluid performance through volume fraction control
10天前
已完结
Enhancing heat transfer across metal/diamond interfaces with a graphene interlayer
10天前
已关闭
Scalable Graphene Fiber Arrays for Superior Thermal Interface Materials with High Reliability
11天前
已完结
Manufacturing-constrained multi-objective optimization of diamond microchannel heat sinks via interpretable machine learning
11天前
已完结
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