Lv11
40 积分 2025-06-18 加入
Concurrent Hydrolysis Resistance and High Thermal Conductivity in Aluminum Nitride Enabled by Phase-Engineered Graphene Encapsulation
8小时前
已完结
Diamond ICP-DRIE Etching with Pecvd SiO2 Thick Masks and its Application on Microchannel Cooling
5天前
已完结
Direct preparation of diamond heat dissipation microchannel assemblies by picosecond laser
7天前
已完结
Enhancing heat transfer across metal/diamond interfaces with a graphene interlayer
7天前
已完结
Enabling record-high heat flux in wide-bandgap electronics via in-chip microfluidic cooling on diamond substrates
11天前
已完结
Magnetic Alignment Meets Phase Separation: Fabricating Flexible Graphite/Silicone Rubber Films with High Through-plane Thermal Conductivity
12天前
已完结
Heat dissipation limit and scenario adaptability of parallel two-phase cold plates for high-power GPUs
13天前
已关闭
High-efficiency heat sink design via SLM-processed diamond TPMS CuCrZr alloy: Optimizing thermal-fluid performance through volume fraction control
13天前
已完结
Enhancing heat transfer across metal/diamond interfaces with a graphene interlayer
13天前
已关闭
Scalable Graphene Fiber Arrays for Superior Thermal Interface Materials with High Reliability
14天前
已完结
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