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28 积分 2025-06-18 加入
BBCube 2.5D: A Bumpless 2.5D Integration Technology Enabling High-Density Inter-Chiplet Interconnection Using Waffle-Wafer and Via-Last TSVs
9天前
已完结
Mechanically Robust and Flexible Nitride Ceramic Nanofibers Enabling Advanced Thermal Management
9天前
已完结
A review on coupled system of topology optimization and phase change material for thermal management: Advances, challenges, and future perspectives
10天前
已完结
Dual nanocellulose-mediated networks enable sustainable 3D-printable phase change composites for thermal management
10天前
已完结
Novel flexible phase change films with outstanding thermochromic and thermal management performance
10天前
已完结
Ion-mediated topological optimization of graphene fiber frameworks for high-performance thermal interface materials at ultralow loading
10天前
已完结
Mechanistic approach on the synergistic optimization of epoxy-based thermal interface materials via diamond micropowders content regulation and surface modification
11天前
已完结
Biomimetic fish-fin microchannels for energy-efficient manifold liquid cooling
11天前
已完结
Ultrahigh Thermal Conductivity and Low Thermal Resistance Carbon Fiber Thermal Pad Achieved by 3D Printing
13天前
已完结
Design and thermal optimization of a high-performance valveless piezoelectric micropump
17天前
已完结
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