Lv14
40 积分 2025-06-18 加入
Breaking Thermal Conductivity–Electrical Resistivity Trade‐Off in Liquid Metal–Based Thermal Interface Materials via Interface Engineering
1天前
已完结
Energy-Efficient Piezoelectric MEMS Cooling Chip for Compact Electronics Based on a Partially Mechanical Decoupled Actuator
1天前
已完结
Microfluidic heat sinks enhanced with a 2D metal framework for flexible thermal management
2天前
求助中
Surface-engineered diamond/liquid metal composites with significantly enhanced thermal conductivity for advanced thermal interface materials
2天前
求助中
Modeling and performance analysis of a novel air-liquid hybrid cooling system for high-power containerized AI data centers
2天前
已完结
Balancing mechanical and thermal properties in epoxy-based solder resists through polyurethane-polyimide hybrids
2天前
已完结
Sustainable hierarchical biocomposites with exceptional thermal conductivity based on programmable microbial biosynthesis
6天前
已完结
Advanced Liquid‐metal Thermal Interface Materials via Gelation
7天前
已完结
Construction of highly thermally conductive epoxy composites via magnetic field-induced alignment of multi-dimensional hybrid BN/CNT fillers
7天前
已完结
Cold Plate Study for Liquid Cooling of Co-Packaged Optics (CPO)
7天前
已完结
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