Lv52
938 积分 2024-03-19 加入
Recent advances in encapsulation strategies for flexible transient electronics
3天前
已关闭
Optimization of a SiOx/SiNxOyCz multilayer structure for a reliable gas diffusion barrier via low-temperature plasma-enhanced atomic layer deposition
14天前
已完结
Bi-layered metal-oxide thin films processed at low-temperature for the encapsulation of highly stable organic photo-diode
16天前
已完结
A Solvent‐Free, Thermally Curable Low‐Temperature Organic Planarization Layer for Thin Film Encapsulation
16天前
已完结
Low temperature SiOx thin film deposited by plasma enhanced atomic layer deposition for thin film encapsulation applications
17天前
已完结
A high-flexible multi-objective stochastic planning system based on nozzle-combined printing in display manufacturing
1个月前
已关闭
Solution Processed Alternating Organic/Inorganic Multilayer for OLED Encapsulation
1个月前
已关闭
Solution Processed Alternating Organic/Inorganic Multilayer for OLED Encapsulation
1个月前
已关闭
TiO2-Nanoparticle-Embedded Thin-Film Encapsulation for Blue Thermally Activated Delayed Fluorescence Top-Emitting Organic Light-Emitting Devices
1个月前
已完结
Stress-matched laminated thin film of SiOxNy/SiO2/ SiOxNy for enhanced encapsulation of organic light-emitting devices
1个月前
已完结
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