Lv51
1468 积分 2024-03-19 加入
Materials‐Engineered Isolation Architecture Enables Ultra‐Uniform Inkjet Printing for Mura‐Free OLED Displays
2个月前
已完结
Hermetic stretchable seals enabled by a viscoplastic surface effect
3个月前
已完结
Recent advances in encapsulation strategies for flexible transient electronics
4个月前
已关闭
Optimization of a SiOx/SiNxOyCz multilayer structure for a reliable gas diffusion barrier via low-temperature plasma-enhanced atomic layer deposition
4个月前
已完结
Bi-layered metal-oxide thin films processed at low-temperature for the encapsulation of highly stable organic photo-diode
4个月前
已完结
A Solvent‐Free, Thermally Curable Low‐Temperature Organic Planarization Layer for Thin Film Encapsulation
4个月前
已完结
Low temperature SiOx thin film deposited by plasma enhanced atomic layer deposition for thin film encapsulation applications
4个月前
已完结
A high-flexible multi-objective stochastic planning system based on nozzle-combined printing in display manufacturing
5个月前
已关闭
Solution Processed Alternating Organic/Inorganic Multilayer for OLED Encapsulation
5个月前
已关闭
Solution Processed Alternating Organic/Inorganic Multilayer for OLED Encapsulation
5个月前
已关闭
皖公网安备34019202002308
