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46 积分 2026-10-08 加入
3DGS 3D Heterogeneous Integrated RF Multi-Layers Glass-Interposer System-in-Package
1小时前
求助中
Modeling Design Fabrication and Demonstration of RF Front-End Module with Ultra-Thin Glass Substrate for LTE Applications
1小时前
已完结
A Hybrid-Integrated K-/Ka-Band Phased Array Module With Dual-Polarized Shared Aperture
14小时前
已完结
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