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Studies of chipping mechanisms for dicing silicon wafers
20天前
已完结
Advanced Dicing Technology for Semiconductor Wafer—Stealth Dicing
20天前
已完结
Experimental studies on drilling tool load and machining quality of C/SiC composites in rotary ultrasonic machining
1个月前
已完结
A cutting force prediction dynamic model for side milling of ceramic matrix composites C/SiC based on rotary ultrasonic machining
1个月前
已完结
A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
1个月前
已完结
Brittle‒ductile transition behavior of 6H-SiC in oblique diamond cutting
1个月前
已完结
Structural anisotropy effect on the nanoscratching of monocrystalline 6H-silicon carbide
1个月前
已完结
Chipping size in Si and SiC wafers dicing with a diamond saw blade – A review
2个月前
已关闭
Evaluation of Zr–V–Fe getter pump for UHV system
3个月前
已完结
Zr/V/Fe thick film for vacuum packaging of MEMS
3个月前
已完结
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