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An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints
7个月前
已完结
To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints
7个月前
已完结
Thermomigration suppression in Sn3.5Ag solder joints by hot-end FeCoNiMn alloy
7个月前
已完结
The microstructure evolution and failure mechanism of Sn37Pb solder joints under the coupling effects of extreme temperature variation and electromigration
7个月前
已完结
Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation
7个月前
已完结
Effect of βSn grain orientations on the electromigration-induced evolution of voids in SAC305 BGA solder joints
7个月前
已完结
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