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132 积分 2023-10-31 加入
Ultrasonic-assisted transient liquid phase bonding of SiC ceramic and aluminum alloy using an inactive Zn interlayer
14小时前
求助中
Ultrasonic-assisted soldering of SiC ceramic and aluminum alloy with a commercial inactive Sn3.0Ag0.5Cu solder
14小时前
已完结
nvestigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation
1个月前
已完结
Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study
2个月前
已完结
Reliability challenges in 3D IC packaging technology
3个月前
已完结
Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology
3个月前
已完结
Mn-Induced microstructural stabilization and mechanical strengthening in Cu-Ni-Sn alloys: A mechanistic exploration
5个月前
已完结
The electromigration study of thin-film structured Sn3.5Ag and Ag using continuous observation and reliability enhancement approach
7个月前
已完结
Simultaneously enhancing the strength and ductility of Cu-Ti-Fe alloy through electric current pulse induced precipitation
7个月前
已完结
The electromigration study of thin-film structured Sn3.5Ag and Ag using continuous observation and reliability enhancement approach
7个月前
已完结
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