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Barrier layer effects on reliabilities of copper metallization
27天前
已关闭
Torque-Driven Grain Rotation in Solder Interconnects under Electromigration for Advanced Packaging: Insights from Phase-Field Simulations
27天前
已完结
Phase-Field Modeling of Grain-Boundary Grooving Under Electromigration
1个月前
已完结
Phase-field modelling of electromigration-induced intergranular slit propagation in metal interconnects
1个月前
已完结
Simulation on Interplay Between Morphological Evolution and Defect in Polycrystalline TSV During EM
1个月前
已完结
Role of Cu/SiO2 Rough Interface in TSV for High-Power Device Under Electromigration
1个月前
已完结
Optimization of Design Parameters Using Taguchi Method for Thermal Stress Analysis in a 3D IC
1个月前
已完结
The effect of silicon anisotropy on the thermal stress of TSV structure of 3D packaging chip under thermal cyclic loads
1个月前
已完结
Thermal Stress Simulation Analysis of Coaxial Through-Silicon Via in All-Silicon Dielectric Layer under Pinhole Defect
1个月前
已完结
Grain Morphology Effects on Void Formation and Electromigration-Induced Failure in Copper Interconnects
3个月前
已完结
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